Camera features of an electronic device

ABSTRACT

An electronic device having a securing member for a camera module is disclosed. The securing member may include several flexible spring elements extending around the camera module to maintain the position of the camera module during an assembly process of the electronic device. The securing member and the housing may be made from an electrically conductive material or materials. In this manner, the securing member may further provide the camera module with an electrical ground to prevent excessive electric charge within the camera module. In some embodiments, an alignment member is positioned on the housing and aligns the camera module and/or securing member with an aperture of the housing.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.14/604,657, filed Jan. 23, 2015, entitled “CAMERA FEATURES OF ANELECTRONIC DEVICE”, which is a continuation of International ApplicationNo. PCT/US15/12693, with an international filing date of Jan. 23, 2015,entitled “CAMERA FEATURES OF AN ELECTRONIC DEVICE”, which claims thebenefit of priority under 35 U.S.C §119(e) to U.S. ProvisionalApplication No. 62/043,666, filed on Aug. 29, 2014, each of which areincorporated herein by reference in its entirety.

FIELD

The described embodiments relate generally to an electronic device. Inparticular, the present embodiments relate to assembly and alignment ofa camera module in the electronic device.

BACKGROUND

Electronic devices, such as smartphones or tablet computing devices,include an integrated camera module for capturing images. In order tofit within the housing of an electronic device, some camera modulesinclude a volume less than 1 cubic centimeter and may be relativelylightweight. Due to the small form factor, some assembly issuesassociated with the camera module may occur. For example, the cameramodule may become dislodged or misaligned during assembly. One solutionis to include apertures or cavities in the camera module such that theapertures or cavities may receive mounting pins in a housing ofelectronic device.

However, similar mounting issues may exist when the mounting pins areutilized. For example, vibration or other movement may cause the cameramodule to become dislodged from the mounting pins. Also, in some cases,a cowling is used to secure the camera module to the housing. When thecamera module is not correctly engaged with the mounting pins, thecowling may apply a force to the camera module, and in turn, themounting pins, causing the mounting pins to break.

SUMMARY

In one aspect, an electronic device is described. The electronic devicemay include a housing. The housing may include an interior region, anexterior region opposite the interior region, and also an apertureextending between the interior region and the exterior region. Theelectronic device may further include a camera module positioned on theinterior region. In some cases, the camera module may include a firstcavity and a second cavity. The electronic device may further include asecuring member that receives the camera module. In some cases, thesecuring member may include a first spring member and a second springmember. In some embodiments, the first cavity receives the first springmember. Also, in some embodiments, the second cavity receives the secondspring member. The electronic device may further include a turretassembly positioned on the exterior region. In some embodiments, theturret assembly extends through the aperture to engage the securingmember.

In another aspect, a securing member for securing an internal componentof an electronic device is described. The securing member may include abase portion electrically connected to a housing of the electronicdevice. The base portion may include an aperture that allows a portionof the internal component to extend through the base portion. Thesecuring member may further include several spring members formed froman electrically conductive material. The several spring members mayextend from the base portion and cooperate to secure the internalcomponent to the housing. In some embodiments, when the internalcomponent engages the several securing members, the base portion and theseveral spring members define an electrical grounding path toelectrically connect the internal component to the housing.

In another aspect, a method for securing an internal component to ahousing of an electronic device is described. The method may includepositioning a securing member in an interior region of the housing. Thesecuring member may be formed from an electrically conductive materialand also include several spring members and an aperture. The method mayfurther include extending the internal component through the aperture ofthe securing member. The method may further include engaging theinternal component with the several spring members to secure theinternal component to the housing. The method may further includeelectrically connecting the securing member to the housing to define anelectrical grounding path for the internal component.

Other systems, methods, features and advantages of the embodiments willbe, or will become, apparent to one of ordinary skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description and this summary, bewithin the scope of the embodiments, and be protected by the followingclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 illustrates an isometric view of an embodiment of an electronicdevice;

FIG. 2 illustrates a rear portion of the electronic device shown in FIG.1, showing an embodiment of a camera module within the electronicdevice;

FIG. 3 illustrates an isometric view of an embodiment of a securingmember configured to receive the camera module and provide an electricalground for the camera module;

FIG. 4 illustrates an exploded view showing an embodiment of anelectronic device having a camera module, a securing member, a housing,and a turret assembly, in accordance with the described embodiments;

FIG. 5 illustrates a plan view of an enlarged portion of an electronicdevice showing some of the components shown in FIG. 4 assembled in theelectronic device, in accordance with the described embodiments;

FIG. 6 illustrates a plan view of an alternate embodiment of an enlargedportion of an electronic device having a securing member welded to aturret assembly, in accordance with the described embodiments;

FIG. 7 illustrates a cross sectional view of an embodiment of a cameramodule, showing the camera module secured to a housing via a securingmember, in accordance with the described embodiments;

FIG. 8 illustrates an isometric view of an embodiment of an assemblyincluding a securing member, a retention member, and a holding memberconfigured to secure a camera module;

FIG. 9 illustrates an isometric view of an alternate embodiment of asecuring member having a retention member configured to secure thecamera module;

FIG. 10 illustrates a side view of an alternative embodiment of anassembly having a retention member and a hook member insert-moldedwithin the retention member;

FIGS. 11 and 12 illustrate a process for improving the concentricity ofthe turret assembly with respect to the housing by rotating the turretassembly;

FIG. 13 illustrates an another method for improving the concentricity ofthe turret assembly with respect to the housing by laser ablating themask portion of the turret assembly, in accordance with the describedembodiments;

FIG. 14 illustrates a method for improving the concentricity of thecamera module with respect to the housing by incorporating alignmentmembers within the housing, in accordance with the describedembodiments;

FIG. 15 illustrates an enlarged portion of an electronic device having acamera module positioned within a securing member, further showing amagnetically attractable member configured to provide a magnetic balancewithin the housing of an electronic device, in accordance with thedescribed embodiments; and

FIG. 16 illustrates a flowchart showing a method for securing a cameramodule to a housing of an electronic device.

Those skilled in the art will appreciate and understand that, accordingto common practice, various features of the drawings discussed below arenot necessarily drawn to scale, and that dimensions of various featuresand elements of the drawings may be expanded or reduced to more clearlyillustrate the embodiments of the present invention described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

The following disclosure relates to an assembly for mounting a cameramodule within an electronic device. The electronic device may include asecuring member attached to a housing of the electronic device. Thesecuring member includes several spring members that secure the cameramodule within the securing member. The spring members may be bendable orflexible in order to provide a retaining force against the camera modulewithin the securing member. Also, the camera module may include anenclosure or outer shield that encloses the internal components of thecamera module. Both the securing member and the enclosure may be formedfrom a metallic material or materials. In this manner, when the securingmember is in contact with the enclosure of the camera module, thesecuring member may provide an electrical pathway in order to dissipateexcessive electrical charge (e.g., static charge) within the cameramodule thereby providing the camera module with an electrical ground,and accordingly and preventing damage to the camera module due toelectrical charge buildup. Alternative embodiments for securing thecamera module to the housing using a silicone-based retention strap aredisclosed.

Also, techniques for improving the assembly process of components of anelectronic device are described. In some embodiments, methods forimproving the concentricity of the turret assembly with respect to thehousing are disclosed. In some embodiments, the method includes rotatingthe turret assembly. In other embodiments, the method includes laserablation or laser etching a mask positioned within the turret assembly.In some cases, the mask is formed having dimensions greater than thespecified tolerance. Once the camera module is installed, thesedimensions may be removed by laser ablation such that the mask includesdesired dimensions. In other embodiments, additional alignment members(e.g., shims) may be added to align a barrel and/or enclosure of thecamera module with respect to the aperture or opening of the housing. Insome cases, an alignment member (e.g., alignment wall for the securingmember) is formed having one or more dimensions that are smaller thanthe specified tolerance. Once the camera module is installed, thesedimensions may be offset by using a shim or shims such that the cameramodule is positioned in a desired location.

Camera modules described in this detailed description may includemagnets designed to focus a camera lens in the camera module. However,these magnets can be attracted to other metallic objects within anelectronic device. Therefore, in some embodiments, a structure havingmagnetically attractable properties (e.g., magnet, ferrous material) isadded to the electronic device to create a “magnetic balance” withrespect to the magnetics within the camera module and offset anymagnetic effects of the other metallic objects.

These and other embodiments are discussed below with reference to FIGS.1-16. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 illustrates an isometric view of an embodiment of electronicdevice 100, or simply device 100. In some embodiments, device 100 is aportable telecommunications device, such as an iPhone®, from Apple, Inc.from Cupertino, Calif. In other embodiments, device 100 is a tabletcomputing device, such as an iPad®, from Apple, Inc. from Cupertino,Calif. Device 100 may further include an enclosure 102 and a cover glass104 positioned within enclosure 102. In some embodiments, device 100includes display 106 positioned between enclosure 102 and cover glass104. Display 106 may be configured to show visual content as well asreceive a gesture, such as a touch input, from a user. Device 100 mayfurther include button 107 as another means for inputting a gesture todevice 100.

FIG. 2 illustrates a rear portion of device 100 shown in FIG. 1, rotatedto show enclosure 102 having camera module 108. Camera module 108 may beconfigured to capture an image of an environment external to device 100.In some embodiments, camera module 108 is includes a VCM (“voice coilmotor”) used for features such as autofocus. Camera module 108 may beconfigured to capture an image by, for example, a user input by touchingdisplay 106 or in some cases, by pressing button 107, both of which areshown in FIG. 1.

During assembly, camera module 108 may require securing means such thatcamera module 108 remains stationary. FIG. 3 illustrates an isometricview of an embodiment of securing member 110 designed to fit betweenenclosure 102 and cover glass 104 (shown in FIG. 2). Securing member 110is designed to receive a camera module (e.g., camera module 108 inFIG. 1) and prevent the camera module from movement during assembly. Insome embodiments, securing member 110 is a plate with several springmembers integrally formed with the plate. For example, as shown,securing member 110 includes first spring member 112, second springmember 114 (opposite first spring member 112), third spring member 116,and fourth spring member 118, all of which are secured to base portion120. Also, securing member 110 includes aperture 122 configured toreceive a barrel of the camera module. The spring members includeelastic properties allowing them to bend inward (for example, in adirection toward aperture 122) and outward (for example, in a directionaway from aperture 122) in order to receive the camera module as well asprovide a retaining force against the camera module to prevent thecamera module from dislodging from securing member 110. In someembodiments, securing member 110 is formed from a metallic material ormaterials, such as aluminum, gold, or stainless steel (for example, SS304 stainless steel). In the embodiment shown in FIG. 3, securing member110 is formed from titanium copper. In this manner, securing member 110may be magnetically inert, that is, unaffected by magnetic fields.Generally, securing member 110 may be formed from any metals known inthe art that are electrically conductive and magnetically inert, andalso include elastic properties that allow for bending means previouslydescribed. Also, in some embodiments, securing member 110 includes twoor three spring members. In other embodiments, securing member 110includes five or more spring members.

FIG. 4 illustrates an exploded view showing an enlarged portion of anembodiment of electronic device 200 having camera module 208, securingmember 210, housing 230, and turret assembly 240. Camera module 208 mayinclude enclosure 250 formed from electrically conducive materials, suchas metal. Enclosure 250 may include several cavities or pockets. Forexample, camera module 208 includes first cavity 252, second cavity 254,third cavity 256, and fourth cavity 258. The enlarged view shows thirdcavity 256 as an exemplary cavity showing a recessed portion. In someembodiments, the cavities are stamped into enclosure 250. In theembodiment shown in FIG. 4, the cavities are laser ablated, or laseretched, using a laser tool (not shown) configured to perform a materialremoval process to enclosure 250. Camera module 208 may also includebarrel 260 protruding from enclosure 250. Also, although FIG. 4 showscamera module 208 secured by securing member 210, securing member 210may be configured to secure other internal components of electronicdevice 200. Generally, any internal component capable of displacementduring an assembly operation of electronic device 200 and/or anyinternal component requiring an electrical grounding path supplied inpart by the securing member 210 may be secured by an alternateembodiment (not shown) of securing member 210.

FIG. 4 further shows securing member 210 that includes first springmember 212, second spring member 214 opposite first spring member 212,third spring member 216, and fourth spring member 218. Securing member210 and the spring members may be made from the same materials aspreviously described for a securing member and spring members,respectively, and may be configured to perform the same functions.Securing member 210 also includes aperture 270 that receives barrel 260.Generally, aperture 270 includes a shape corresponding to that of barrel260. Also, first cavity 252, second cavity 254, third cavity 256, andfourth cavity 258 are designed to receive first spring member 212, thirdspring member 216, and fourth spring member 218, respectively, whencamera module 208 is inserted into securing member 210.

Housing 230 and its features may be configured to receive camera module208 and securing member 210. In some embodiments, housing 230 is madefrom a metallic material or materials capable of conducting electricalcurrent. Housing 230 may also include alignment member 280 located oninterior region 232 of housing 230. Interior region 232 may beassociated with an internal portion of several internal components ofelectronic device 200. In some embodiments, alignment member 280 is madefrom a pre-formed resin material. In the embodiment shown in FIG. 4,alignment member 280 is made from plastic. Alignment member 280 mayinclude first opening 282, second opening 284 (opposite first opening282), third opening 286 and fourth opening 288. These openings aredesigned and positioned within alignment member 280 such that the springmembers of securing member 210 may be positioned within the openings ofalignment member 280. For example, first opening 282 is designed toreceive first spring member 212. Also, alignment member 280 can bedesigned such that when securing member 210 is positioned withinalignment member 280, aperture 270 of securing member 210 is concentric,or aligned and centered, with aperture 290 of housing 230. In thismanner, camera module 208 (in particular, barrel 260) may be readilyreceived by aperture 290 of housing 230.

FIG. 4 further shows turret assembly 240 including turret 242, mask 244and window 246. Turret 242 may include aperture 292 concentric withrespect to aperture 290 when turret assembly 240 is assembled to housing230. Also, turret 242 may be made from materials resistant to deformingunder high heat, such as metal. In this regard, turret 242 may be weldedto securing member 210. This will be discussed later. Mask 244 isgenerally an opaque ring-like structure having an aperture 294, and mayprevent excessive light from reaching camera module 208. This may beambient light or light from a camera flash of an electron device that isreflected toward camera module 208. Also, mask 244 may provide acosmetic enhancement to electronic device 200. Mask 244 may beadhesively secured to turret 242 and/or window 246. Window 246 isgenerally transparent and may provide protection to a lens (not shown)of camera module 208. Window 246 may be adhesively secured to turret242. Turret assembly 240 may be engaged with exterior region 234 ofhousing 230. Exterior region 234 may be associated with an outer surfaceof electronic device 200 generally visible when electronic device 200 isassembled. In other words, exterior region 234 is opposite interiorregion 232. In some embodiments, aperture 290 is designed to receive aportion of turret assembly 240. Also, in some embodiments, when thecomponents shown in FIG. 4 are assembled, turret assembly 240 is securedto securing member 210 (e.g., by welding). Further, based on theapertures of turret 242 and mask 244 as well as the transparency ofwindow 246, turret assembly 240 may define a viewing range for cameramodule 208 when camera module 208 captures an image. Also, in someembodiments, barrel 260 may extend through aperture 270 of securingmember 210, aperture 290 of housing 230, and aperture 292 of turret 242.

FIG. 5 illustrates a plan view of an enlarged portion of electronicdevice 200 showing some of the components shown in FIG. 4 assembled inelectronic device 200. The camera module is removed for purposes ofillustration. As shown, securing member 210 is positioned withinalignment member 280. In some embodiments, securing member 210 andturret assembly 240 are adhesively secured to housing 230 by, forexample, a conductive adhesive. In other embodiments, securing member210 and turret assembly 240 are secured to housing 230 by solder. In theembodiment shown in FIG. 5, securing member 210 and turret assembly 240are welded to housing 230. As shown, first weld 312 and second weld 314form an electro-mechanical bond to secure securing member 210 and turretassembly 240 proximate to aperture 290 of housing 230. In this manner,securing member 210 and housing 230, both of which may be formed fromelectrically conductive materials, may provide an electrical ground forcomponents in contact with securing member 210, such as a camera module.In other embodiments, the weld or welds extend around the entirecircumference of aperture 290. Not only is securing member 210 able toprevent a camera module from lateral (X-Y) movement as well as movementin a z-direction perpendicular to the X-Y axis, but securing member 210also provides a means for electrically grounding the camera modulepositioned in securing member 210. Accordingly, securing member 210 ofelectronic device 200 may be referred to as a multi-functional componentwhich may reduce the number of necessary components in electronic device200, which in turn may reduce the number of manufacturing steps.

Also, although not shown, a cowling may be positioned over the cameramodule after the camera module is secured to securing member 210.Electronic device 200 may include first fastener 322 and second fastener324 configured to secure the cowling over the camera module.

Securing members may include different configurations/orientations ofspring members. Accordingly, a housing may include differentconfigurations of alignment members. For example, FIG. 6 illustrates aplan view of an alternative embodiment of electronic device 300 thatincludes securing member 360 and alignment member 380. In thisembodiment, securing member 360 includes first spring member 362 andsecond spring member 364, both of which are on a same side or edge ofsecuring member 360. Securing member 360 may further include thirdspring member 366 opposite first spring member 362, and fourth springmember 368 opposite second spring member 364. Accordingly, alignmentmember 380 may include openings (e.g., first opening 382) in differentlocations corresponding to the aforementioned spring members. It will beappreciated that securing member 360 and the spring members may be madefrom the same materials as previously described for a securing memberand spring members, respectively, and may be configured to performsimilar functions. Also, FIG. 6 shows securing member 360 welded toturret assembly 390 via first weld 372 and second weld 374, andaccordingly, securing member 360 and turret assembly 390 are secured tohousing 330.

FIG. 7 illustrates a cross sectional view of an embodiment of cameramodule 408, showing camera module 408 secured to a housing 430 ofelectronic device 400 via a securing member 410, in accordance with thedescribed embodiments. Securing member 410 includes first spring member412 positioned within first cavity 452 of enclosure 450 of camera module408. First spring member 412 is shown in a secured position in order toprovide a retaining force against camera module 408 to prevent cameramodule 408 from unwanted movement. To illustrate the flexibility offirst spring member 412, FIG. 7 shows first spring member 412 may be ina first position 462 (dotted lines) when camera module 408 is notpositioned within securing member 410. Also, first spring member 412 maybe in a second position 464 (dotted lines) while camera module isinserted into securing member 410 but before first spring member 412 ispositioned within first cavity 452. Also, first cavity 452 is formed inenclosure 450 by a laser etch process (not shown). First cavity 452 mayinclude a depth 470 within enclosure approximately in the range of 30-70micrometers. It will be appreciated that other spring members disclosedmay perform in a similar manner as that of first spring member 412.

In some embodiments, housing 430 is anodized in order to provide certainaesthetic features. This may subject housing 430 to several chemicals(e.g., acids) which may define an anodized layer on housing 430configured to enhance the appearance and strength of housing 430.However, the anodization layer is generally non-conductive in terms ofelectrical conductivity. However, a portion of housing 430 in directcontact with securing member 410 may be free of an anodization layersuch that housing 430 combines with securing member 410 to provide anelectrical ground for camera module 408. In the embodiment shown in FIG.7, housing 430 includes anodization layer 432, but further includesfirst portion 434 and second portion 436 which define areas of housing430 in which anodization layer 432 is removed. First portion 434 andsecond portion 436 allow securing member 410 to be in electro-mechanicalcontact with housing 430 such that housing 430 combines with securingmember 410 to for an electrical ground for camera module 408. Removalmeans of anodization layer 432 may include laser ablating or laseretching, sanding, grinding, etc.

An electronic device may include other securing means for securing acamera module during assembly. For example, FIGS. 8-10 illustrate anembodiment of an assembly having a securing member attached to aretention member. FIG. 8 illustrates an isometric view of an embodimentof assembly 502 including securing member 510, retention member 520, andholding member 530, all of which combine to secure a camera module.Retention member 520 may be a flexible strap configured to providesecuring means for a camera module in addition to securing means bysecuring member 510. In some embodiments, retention member 520 is formedfrom a silicone-based material or materials. Also, in some embodiments,retention member 520 includes a plate 522. Plate 522 may be integrallyformed with retention member 520 by an insert-molding process. This mayinclude pouring a silicone-based material into a mold (not shown) thatincludes plate 522. In this manner, plate 522 may provide additionalrigidity to retention member 520. Also, plate 522 may further includefirst aperture 524 and second aperture 526 configured to receive firstspring member 512 and second spring member 514, respectively. Inparticular, a portion of first spring member 512 and a portion of secondspring member 514 may define hook members configured to extend throughfirst aperture 524 and second aperture 526, respectively. Also, assembly502 may further include holding member 530 configured to seat a cameramodule. Holding member 530 may act as a cup for the camera module,providing further support during an assembly process. FIG. 9 illustratesan alternative embodiment of assembly 602 having securing member 610 andretention member 620, but without holding member 530 (shown in FIG. 8).

FIG. 10 illustrates a side view of an alternative embodiment of theassembly 702 having retention member 720 and hook member 722insert-molded within retention member 720. Hook member 722 includes anaperture 724 designed to receive first spring member 712 of securingmember 710. In this embodiment, additional structure (e.g., plate 522 inFIG. 8) is not included in an insert-molding process and may reducematerials used as well as the weight of the electronic device.

Most components in successive electronic devices are generally similar.In this regard, components, such as a camera module or a securingmember, built within their respective specified tolerances may beinstalled in any electronic device designed to receive the camera moduleor the securing member. However, in some cases, several componentsdesigned to be assembled together may be at or near the outer ranges oftheir respective specified tolerances. Moreover, the more componentsassembled together, the greater the probability for alignment issues dueto tolerance issues as additional components lead to additionaltolerances. For example, a turret assembly is designed to include partsthat have certain characteristics (e.g., concentricity). However, eachcomponent of the turret assembly—mask, window, and turret—has its ownspecified tolerance. In other words, each component is allowed at leastsome variance. As a result, a turret assembly, when assembled, mayinclude a sum of the variances of its components. In cases where two ormore components are at their respective outer ranges of specifiedtolerances, the turret assembly may be assembled in an undesirablemanner. This includes a mask having an aperture that is not concentricwith respect to an aperture of a turret. Accordingly, the turretassembly may not be concentric with respect to an aperture of a housing.

In order to account for these multiple tolerances, several techniqueshave been developed. For example, FIGS. 11 and 12 illustrate a processfor improving the concentricity of an aperture associated within aturret assembly and an aperture associated with a housing of anelectronic device. FIG. 11 illustrates an enlarged portion of electronicdevice 800 including turret assembly 810 having mask 812 (shaded region)and window 814. Also, mask 812 includes center 816 denoted as a point.Housing 830 includes aperture 832 having center 836 denoted as a point.As shown, turret assembly 810 is engaged with housing 830. Ideally, mask812 is concentric with respect to aperture 832 and center 816 issuperimposed on center 836, or vice versa. However, due to specifiedtolerance issues previously described, mask 812 is not concentric withrespect to aperture 832, even though the individual components of turretassembly 810 are within their respective specified tolerances.

FIG. 12 illustrates electronic device 800 in FIG. 11, with turretassembly 810 rotated such that mask 812 is concentric with respect toaperture 832, and center 816 is superimposed on center 836. In thisembodiment, the angle of rotation is approximately 180 degrees. In otherembodiments, a lesser angle of rotation may be required to create theimproved concentricity. This process removes the need for a binningprocess in which components are pre-selected for each electronic device,which may reduce assembly times. Also, most, if not all, components maybe used in any electronic device resulting in improved yields.

Other means for improving the relationship of components may be used.For example, FIG. 13 illustrates an enlarged portion of electronicdevice 900 having turret assembly 910 including mask 912. As shown, mask912 is formed with a greater amount of material than desired. In otherwords, mask 912 includes an aperture intentionally formed to be outsidea specified tolerance. However, a laser ablation or laser etchingprocess may be used to remove a portion to place mask 912 within aspecified tolerance of mask 912. As shown in FIG. 13, mask 912 includesa laser-ablated portion 922. A laser tool (not shown) may be used toremove additional portions of mask 912 such that mask 912 is within aspecified tolerance 920, denoted by dotted lines. In order to determinewhich locations of mask 912 are to be ablated, housing 930 may bemeasured in the x- and y-directions. In this manner, mask 912 may beused for any electronic device thereby reducing yield loss.

FIG. 14 illustrates an enlarged portion of device 1000 having alignmentmember 1020 formed with a formed with smaller dimensions than desired.In other words, alignment member 1020 is intentionally formed to beoutside a specified tolerance. However, in the embodiment in FIG. 14,first alignment structure 1022 and second alignment structure 1024 areinserted between securing member 1010 and alignment member 1020 in orderto align securing member 1010. In some embodiments, first alignmentstructure 1022 and second alignment structure 1024 are shims havingdimensions which, when inserted, allow for securing member 1010 and/or acamera module (not shown) to be installed in a desired manner. Thisincludes, for example, a barrel of the camera module being concentricwith respect to aperture 1032 of housing 1030. In some embodiments, onlyfirst alignment structure 1022 is required. Also, in some embodiments,first alignment structure 1022 and/or second alignment structure 1024are positioned in different locations of housing 1030. In order todetermine the locations of first alignment structure 1022, and in somecases, second alignment structure 1024, dimensions of the camera moduleand the dimensions of housing 1030 are measured in the x- andy-directions. In this manner, alignment member 1020 may be used for anyelectronic device thereby reducing yield loss.

Also, in some embodiments, measurements of a housing may be used foradditional purposes. For example, a group consisting of, for example,five to ten camera modules may be measured, and in particular, theenclosures of the camera modules. After measuring the dimensions of thehousing, the camera module selected for a particular device isdetermined by the enclosure that most closely matches correspondingmeasurements of the housing. In this manner, the selected camera modulerepresents the “best fit” for the housing.

In order to focus the camera module, some camera modules include amagnet or magnets positioned within an enclosure of the camera module.For example, FIG. 15 illustrates an enlarged portion of electronicdevice 1050 having camera module 1052 positioned within securing member1060. Camera module 1052 may include first magnet 1056 and second magnet1058, both of which are configured to actuate barrel 1054 to focuscamera module 1052. Further, the region 1064 may be a location whichreceives, for example, a hook member configured to secure a cover glass(not shown). In some cases, the hook member (not shown) is formed fromsteel or other magnetically attractable materials. As such, first magnet1056 and second magnet 1058 may be attracted to the hook member, orother magnetically attractable structures proximate to camera module1052. This may affect the focusing ability of camera module 1052.

In order to offset or discount the effects of magnetically attractablestructure or structures, electronic device 1050 may include material1070 positioned in a location opposite the magnetically attractablestructure or structures in region 1064. In some embodiments, material1070 is a magnet having a polarity opposite first magnet 1056 and/orsecond magnet 1058. In other embodiments, material 1070 is formed from aferrous material or materials known to be attracted to a magnet. In thismanner, material 1070 provides a “magnetic offset” with respect to amagnetically attractable member in region 1064, and the functionality offirst magnet 1056 and second magnet 1058 is not disrupted.

FIG. 16 illustrates a flowchart 1100 showing a method for securing acamera module to housing of an electronic device. In step 1102, asecuring member is positioned between the camera module and a firstportion of the housing. In some embodiments, the housing includes anaperture extending through the housing. Also, in some embodiments, thesecuring member and the housing are formed from an electricallyconductive material or materials. In step 1104, the camera module isextended through the securing member. In some embodiments, the cameramodule includes a cavity formed within an enclosure of the cameramodule. In step 1106, a turret assembly is positioned proximate to asecond portion of the housing. The second portion of the housing refersto a location opposite the first portion of the housing. In step 1108,the turret assembly is extended through the aperture. Then in step 1110,the securing member is attached to the turret assembly. For example, thesecuring member may be welded to the turret assembly. In this manner,the securing member coupled with the housing may form an electricalground for the camera module when the camera module is secured to thesecuring member.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling manufacturing operations oras computer readable code on a computer readable medium for controllinga manufacturing line. The computer readable medium is any data storagedevice that can store data which can thereafter be read by a computersystem. Examples of the computer readable medium include read-onlymemory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, andoptical data storage devices. The computer readable medium can also bedistributed over network-coupled computer systems so that the computerreadable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

1.-20. (canceled)
 21. An electronic device, comprising: a housingdefining an interior region, the housing having a housing through hole;a camera module disposed in the interior region, the camera modulehaving a first cavity and a second cavity; a single-piece securingmodule that secures the camera module with the housing, the single-piecesecuring module comprising: a base portion that includes a through holealigned with the housing through hole, a first spring member engagingthe first cavity, and a second spring member engaging the second cavity;and an alignment member disposed in the interior region, the alignmentmember comprising a first opening that receives the first spring memberand a second opening that receives the second spring member.
 22. Theelectronic device of claim 21, wherein: the single-piece securing modulefurther comprises a third spring member and a fourth spring member, thecamera module further comprises a third cavity that receives the thirdspring member and a fourth cavity that receives the fourth springmember, and the first spring member, the second spring member, the thirdspring member, and the fourth spring member combine to define aretaining force for the camera module.
 23. The electronic device ofclaim 22, wherein the alignment member further comprises: a thirdopening that receives the third spring member; and a fourth opening thatreceives the fourth spring member.
 24. The electronic device of claim23, wherein the alignment member is formed from plastic.
 25. Theelectronic device of claim 21, wherein the camera module comprises abarrel that extends through the second through hole.
 26. The electronicdevice of claim 25, wherein the barrel extends at least partiallythrough the housing through hole.
 27. The electronic device of claim 21,wherein the single-piece securing module combines with the housing todefine an electrical grounding path for the camera module.
 28. Asecuring member for securing a camera module to a housing of anelectronic device, the securing member comprising: a base portionseparate from the housing and formed from a single piece electricallyconductive material, the base portion comprising a through hole thatallows a portion of the camera module to extend through the baseportion; and multiple spring members formed from the single pieceelectrically conductive material, the multiple spring members integrallyformed with and extending from the base portion and cooperating tosecure the camera module to the base portion, wherein when the multiplespring members secure the camera module, the base portion and themultiple spring members define an electrical grounding path for thecamera module.
 29. The securing member of claim 28, wherein the multiplespring members comprises a first spring member and a second springmember, the first spring member and the second spring member extendingfrom a first side of the base portion.
 30. The securing member of claim29, wherein the multiple spring members further comprises a third springmember and fourth spring member, the third spring member extending froma second side of the base portion different from the first side, thefourth spring member extending from a side selected from the second sideor a third side of the base portion different from the first side andthe second side.
 31. The securing member of claim 30, wherein: the firstspring member is adapted to engage a first cavity of the camera module,the second spring member is adapted to engage a first cavity of thecamera module, the third spring member is adapted to engage a firstcavity of the camera module, and the fourth spring member is adapted toengage a first cavity of the camera module.
 32. The securing member ofclaim 29, further comprising a third spring member and a fourth springmember, wherein: the base portion includes a first side and a secondside opposite the first side, the first spring member and the secondspring member extend from the first side, and the third spring memberand the fourth spring member extend from the second side.
 33. Thesecuring member of claim 28, wherein both the base portion and themultiple spring members are formed only from the single pieceelectrically conductive material.
 34. The securing member of claim 33,wherein the single piece electrically conductive material includes ametallic material selected from a group consisting of gold, aluminum,stainless steel, and titanium copper.
 35. A method for assembling anelectronic device having an housing that defines an interior region, thehousing having a housing through hole, the method comprising: securing acamera module with a single-piece securing module in the interiorregion, the camera module having a first cavity and a second cavity, thesingle-piece securing module comprising: a base portion including athrough hole aligned with the housing through hole, a first springmember engaging the first cavity, and a second spring member engagingthe second cavity; and surrounding the single-piece securing module withan alignment member, the alignment member comprising a first openingthat receives the first spring member and a second opening that receivesthe second spring member.
 36. The method of claim 35, further comprisingsecuring the single-piece securing module to a turret assembly comprisesby welding the single-piece securing module to the turret assembly. 37.The method of claim 36, further comprising aligning an aperture of theturret assembly such that the aperture of the turret assembly isconcentric with respect to the aperture of the single-piece securingmodule.
 38. The method of claim 35, wherein securing the camera moduleto the single-piece securing module comprises engaging the camera modulewith a first spring member of the single-piece securing module and asecond spring member of the single-piece securing module.
 39. The methodof claim 38, wherein engaging the securing with the first spring memberand the second spring member comprises: engaging the first spring memberwith a first cavity of the camera module; and engaging the second springmember with a second cavity of the camera module.
 40. The method ofclaim 35, further comprising aligning the single-piece securing modulewith the housing through hole such that the through hole of thesingle-piece securing module is concentric with respect to the housingthrough hole.